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de0 nano manualThe desired driver is not available on the Windows Update Web site, therefore select \u201cNo, not this This leads to the window in Figure 6-3. Hence, select \u201cInstall from a list or specific Now, select \u201cSearch for the best driver in these locations\u201d and click Browse to get to the pop-up C:\altera\10.1\quartus\drivers\usb-blaster. Click OK and then upon returning to Figure 6-4 click. Next. At this point the installation will commence, but a dialog box in Figure 6-6 will appear Click Continue Anyway. DE0-Nano board. In this tutorial you will perform the following tasks. Create a design that causes LEDs on the development board to blink at two distinct rates. This Of course, you can use For the LED design, you will write Verilog HDL When the design is running on the board, you can Begin this tutorial by creating a new Quartus II project. A project is a set of files that maintain The Quartus II Settings File (.qsf) and Quartus II Project File To compile a design or make pin The steps used to create a project are: Enter a directory in which you will store your. Quartus II project files for this design.Figure 6-9. Select the. EP4CE22F17C6 device, as it is the FPGA on the DE0-Nano, as shown in Figure 6-10. You just created your. Quartus II FPGA project. Your project is now open in Quartus II, as shown in Figure 6-11. This section describes how to create an FPGA design. This includes creating the top-level design, First, create a top-level module. In this tutorial, you will use schematic entry, via a Block Design. File (.bdf). Alternatively, you could use Verilog HDL or VHDL for the top-level module. The Block1.bdf, which you will save as the top-level design. The resulting empty file is ready for you to enter the Verilog HDL code. The Quartus II software creates a Symbol File and displays a message (see Figure 6-16). Click to place the. You can move the block after placing it by simply clicking See Figure 6-18.http://genclergida.com/userfiles/fellowes-powershred-p-58cs-manual.xml
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Megafunctions, such as the ones available in the LPM, are pre-designed modules that you can use in. FPGA designs. These Altera-provided megafunctions are optimized for speed, area, and device. The on-board dip-switch determines which channel to read DIP Switch (SW1) Setting ADC Channel Connect the trimmer to the ADC The following items are required for the ADC Reading demonstration The demo batch file includes the following files: DDeemmoonnssttrraattiioonn SSeettuupp GND signals. This will load the demo into the FPGA. Note a fully This demostration illustrates how to use the SOPC Builder to create a system with the following This section describes the SOPC System Block Diagram of this demo, as shown in Figure 8-6. A 50 MHz Clock is required for the SOPC System. A NIOS II processor is included in the system NIOS II Processor and SDRAM are running at 100 MHZ. The SDRAM is used to store the NIOS II. Program. The ADC SPI Controller is running at 2 MHz. The other peripheral controllers are running Quartus II project. The other components are standard SOPC Builder components. It is design to generate an The interrupt event is used to terminate For default, the interrupt is disabled in the PIO Controller. Users can enable it with the parameter The accelerometer controller is a custom SOPC component developed by Terasic. The source code. In this demo, the accelerometer is controlled through a 3-wire SPI. Before reading any data from the In the demo, multiple-byte read of six The timing diagram of 3-wire SPI is shown below Figure 8-10: The Analog to Digital Conversion is controller through a 4-wire SPI interface with the timing dialog The DOUT signal is used to read the data conversion result whose channel is The first conversion result after power-up will be on IN0. The EEPROM is accessed through the I2C interface. In this demo, I2C signal is toggle by NIOS II The I2C clock signal is driver by an OUTPUT PIO Controller and the.http://www.frimaslovakia.sk/userfiles/file/fellowes-ps-67cs-manual.xml I2C data signal is driver by a BIDIRECTION PIO Controller. The I2C C code is located in: EPCS64 is accessed through the EPCS interface. In Quartus 10.0 or later, the EPCS pin assignment For the EPCS access functions, users can refer to: DDeemmoonnssttrraattiioonn BBaattcchh FFiillee. The demo batch file includes the file. DDeemmoonnssttrraattiioonn SSeettuupp This will load the demo into the FPGA. The demo starts by displaying the accelerometer\u2019s Upon exiting the. Related documents Test 2 1 September 2013, questions and answers DE1 Basic Computer - Lecturer Mr Mpiana DE1 introduction box - Lecturer Mr Mpiana Design OF Timer FOR Application IN ATM Using vhdl and fpga Ijiset V2 I4 204 - Lecturer Mr Mpiana Jzhao - Lecturer Mr Mpiana Preview text 1Introduction. The DE0-Nano board introduces a compact-sized FPGA development platform suited for to a wideThe DE0-Nano is ideal for use with embedded soft processors—it features a powerful Altera Cyclone. IV FPGA (with 22,320 logic elements), 32 MB of SDRAM, 2 Kb EEPROM, and a 64 Mb serialFor connecting to real-world sensors the DE0-Nano includes aThe DE0-Nano board includes a built-in USB Blaster for FPGA programming, and the board can beThe board includes expansionFigure 1-1 shows a photograph of the DE0-Nano Board. Figure 1-1. The DE0-Nano BoardThe kit comes with the following contents. The system CD contains technical documents for the DE0-Nano board, which includes componentFigure 1-2 shows the photograph of the DE0-Nano kit contents. Figure 1-2. DE0-Nano kit package contentsHere is information of how to get help if you encounter any problem:DE0DE0-Nano Board Architecture. This chapter describes the architecture of the DE0-Nano board including block diagram andThe picture of the DE0-Nano board is shown in Figure 2-1 and Figure 2-2. It depicts the layout ofFigure 2-1. The DE0-Nano Board PCB and component diagram (top view)The DE0-Nano board comes with a preloaded configuration bit stream to demonstrate someThis allows users to see quickly if the board is working properly. To power-upBlaster driver software.At this point you should observe flashing LEDs on the board.Using the DE0DE0-Nano Board. This chapter gives instructions for using the DE0-Nano board and describes in detail its componentsThe DE0-Nano board contains a Cyclone IV E FPGA which can be programmed using JTAGThe configuration information will be lost whenTo download a configuration bit stream file using JTAG Programming into the Cyclone IV FPGA,Configuring the Spansion EPCS64 device. The DE0-Nano board contains a Spansion EPCS64 serial configuration device. This deviceWhen the board’s power isThe serial flash loader is a bridge design forAS interface to program the EPCS device. Figure 3-1 illustrates the programming method whenChapter 9 of this document describes how to load a circuit toConnections between the push-buttons and Cyclone IV FPGA. Pushbutton depressed. Pushbutton released. Before. Debouncing. Schmitt Trigger. Debounced. Figure 3-4. Pushbuttons debouncing. LEDs. There are 8 green user-controllable LEDs on the DE0-Nano board. The eight LEDs, which areEach LED isEach LED is driven directly by a pin on the Cyclone IV. E FPGA; driving its associated pin to a high logic level turns the LED on, and driving the pin lowDIP Switch. The DE0-Nano board contains a 4 dip switches. A DIP switch provides, to the FPGA, a high logicTable 3-1. Signal Name. Pin Assignments for Push-buttons. FPGA Pin No. DescriptionSignal Name. FPGA Pin No. DescriptionSDRAM Column Address Strobe. SDRAM Clock Enable. SDRAM Clock. SDRAM Write Enable. SDRAM Chip SelectThe DE0-Nano contains a 2Kbit Electrically Erasable PROM (EEPROM). The EEPROM isThe device is organized as one block of 256 x 8-bitFigure 3-7 illustrates itsConnections between FPGA and EEPROM. Table 3-5 Pin Assignments for I2C Serial EEPROM. Signal Name. FPGA Pin No. Description. EEPROM clock. EEPROM dataThe DE0-Nano board provides two 40-pin expansion headers. Each header connects directly to 36Signal Name. FPGA Pin No. Description. GPIO Connection DATA. Visit our export site or find a local distributor. Activity Translate Error: You don't have JavaScript enabled. This tool uses JavaScript and much of it will not work correctly without it enabled. Please turn JavaScript back on and reload this page. Last modified by Ankur Tomar on Sep 9, 2012 6:02 PM. Connect with your peers and get expert answers to your questions. All Rights Reserved. New products are added daily, so check back frequently. Cyclone V SoC devices are also offered in a low-power v ariant, as indicated by the L power option in the device part number. These devices have 30 static power reduction for devices with 25K LE and 40K LE, and 20 static power reduction for devices with 85K LE and 110K LE. All rights reserved. Intel warrants performance of its FPGA and semiconductor products to current specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Intel. ISO 9001:2015 Registered. Related Information Cyclone V Device Overview Provides more information about the densities and packages of devices in the Cy clone V family. Electrical Characteristics The following sections describe the operating conditions and power consumption of Cy clone V devices. Operating Conditions Cyclone V devices are r ated according to a set of defined parameters. T o maintain the highest possible performance and reliability of the Cyclone V devices, you must consider the oper ating requirements described in this section. Absolute Maximum Ratings This section defines the maximum operating conditions for Cy clone V devices. The values are based on experiments conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the device is not implied for these conditions. Caution: Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device operation at the absolute maximum r atings for extended periods of time may have adverse effects on the device. The maximum allowed overshoot dur ation is specified as a percentage of high time over the lifetime of the device. A DC signal is equivalent to 100 duty cy cle.Power supply ramps must all be strictly monotonic, without plateaus. Cyclone V devices do not exit POR if V CCBA T is not powered up. (7) This is also applicable to HPS power supply. For more information about the maximum full duplex channels recommended in Cyclone V GT and ST devices for CPRI 6.144 Gbps, refer to the Transceiver Protocol Configurations in Cyclone V Devices chapter. Power supply r amps must all be strictly monotonic, without plateaus. Refer to the Recommended Operating Conditions for Cyclone V Devices table for the steady-state voltage v alues expected from the FPGA portion of the Cyclone V SoC devices. Use the Excel-based EPE before you start y our design to estimate the supply current for your design. The EPE provides a magnitude estimate of the device power because these currents vary greatly with the resources y ou use. The Intel Quartus Prime P ower Analyzer provides better quality estimates based on the specifics of the design after you complete place-and-route. The P ower Analyzer can apply a combination of user-entered, simulation-derived, and estimated signal activities that, when combined with detailed circuit models, yields very accurate power estimates.When process, voltage, and temperature (PVT) conditions change after calibr ation, the tolerance may change. R S Internal series termination with calibration (25-.OCT Without Calibration Resistance Tolerance Specifications for Cyclone V Devices This table lists the Cyclone V OCT without calibration resistance toler ance to PVT changes. R S Internal series termination without calibration (25-. R D Internal differential termination (100-. OCT Variation after Power-Up Calibration Table 11. OCT Variation after Power-Up Calibration for Cyclone V Devices This table lists OCT variation with temper ature and voltage after power-up calibr ation.F or example, to meet the 3.3-V L VT TL specification (4 mA), you should set the current strength settings to 4 mA. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet. F or example, to meet the SSTL15CI specification (8 mA), you should set the current strength settings to 8 mA. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet. F or example, to meet the SSTL15CI specification (8 mA), you should set the current strength settings to 8 mA. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet. Howev er, each single-ended signal needs to be within the respective single-ended limits (V IH(DC) and V IL(DC) ). R L ? 110 ?. (23) This applies to default pre-emphasis setting only. (24) For optimiz ed L VDS receiver performance, the receiver voltage input r ange must be within 1.0 V to 1.6 V for data rate above 700 Mbps and 0.00 V to 1.85 V for data rate below 700 Mbps. (25) There are no fixed V ICM, V OD, and V OCM specifications for BL VDS. Switching Characteristics This section provides performance characteristics of Cyclone V core and periphery blocks. (21) The minimum V ID value is applicable o ver the entire common mode range, V CM. (22) R L range: 90. R L ? 110 ?. (23) This applies to default pre-emphasis setting only. (29) For optimiz ed L VPECL receiver performance, the receiver voltage input r ange must be within 0.85 V to 1.75 V for data rate above 700 Mbps and 0.45 V to 1.95 V for data rate below 700 Mbps.For more information about the maximum full duplex channels recommended in Cyclone V GT and ST devices for CPRI 6.144 Gbps, refer to the Transceiver Protocol Configurations in Cyclone V Devices chapter. (36) The transmitter REFCLK phase jitter is 30 ps p-p at bit error r ate (BER) 10 -12.N PMA bonded mode — — 500 — — 500 — — 500 ps Table 25.F or more information about the maximum full duplex channels recommended in Cyclone V GT and ST devices under this condition, refer to the Transceiver Protocol Configurations in Cyclone V Devices chapter. For more information about the maximum full duplex channels recommended in Cyclone V GT and ST devices for CPRI 6.144 Gbps, refer to the Transceiver Protocol Configurations in Cyclone V Devices chapter. PLL Specifications for Cyclone V Devices This table lists the Cyclone V PLL block specifications. Cyclone V PLL block does not include HPS PLL. The output jitter specification applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. The external memory interface clock output jitter specifications use a different measurement method and are av ailable in Memory Output Clock Jitter Specification for Cyclone V Devices table. (59) This specification only covers fr actional PLL for low bandwidth.Use the Intel Quartus Prime softw are to report timing for the memory block clocking schemes. Actual achievable frequency depends on design and system specific factors. For L VDS applications, you must use the PLLs in integer PLL mode. This is achieved by using the L VDS clock network. The interface F max is also dependent on the par allel clock domain which is design dependent and requires timing analysis. (65) The minimum specification depends on the clock source (for example, the PLL and clock pin) and the clock routing resource (global, regional, or local) that you use. PLL max output frequency (f out ), provided you can close the design timing and the signal integrity simulation is clean. Y ou can estimate the achiev able maximum data rate by performing link timing closure analysis. Y ou must consider the board skew margin, tr ansmitter delay margin, and receiver sampling margin to determine the maximum data rate supported. (67) Y ou must calculate the leftover timing margin in the receiv er by performing link timing closure analysis. Y ou must consider the board skew margin, tr ansmitter channel-to-channel skew, and receiver sampling margin to determine the leftover timing margin.Intel recommends using the UniPHY intellectual property (IP) with PHYCLK connections for better jitter performance.It does not cover the system DCD. HPS Clock Performance Table 40.Related Information Clock Select, Booting and Configuration chapter Provides more information about the clock range for different v alues of clock select (CSEL). HPS PLL Input Jitter Use the following equation to determine the maximum input jitter (peak -to-peak) the HPS PLLs can tolerate. The divide value (N) is the value progr ammed into the denominator field of the VCO register for each PLL. The PLL input reference clock is divided by this value. The r ange of the denominator is 1 to 64.F or more information about R delay, refer to the Quad SPI Flash Controller chapter in the Cyclone V Hard Processor System Technical Reference Manual.SPI Timing Characteristics Table 44. SPI Master Timing Requirements for Cyclone V Devices The setup and hold times can be used for T exas Instruments SSP mode and National Semiconductor Microwire mode. Note that a delay of 0 is not allowed. The setup time can be used as a reference starting point. SPI Slave Timing Requirements for Cyclone V Devices The setup and hold times can be used for T exas Instruments SSP mode and National Semiconductor Microwire mode. After the Boot ROM code exits and control is passed to the preloader, software can adjust the v alue of drvsel and smplsel via the system manager. USB Timing Characteristics PHY s that support LPM mode may not function properly with the USB controller due to a timing issue. NAND ONFI 1.0 Timing Requirements for Cyclone V Devices The NAND controller supports Open NAND FLASH Interface (ONFI) 1.0 Mode 5 timing as well as legacy NAND devices. This table lists the requirements for ONFI 1.0 mode 5 timing. The HPS NAND controller can meet this timing by programming the C4 output of the main HPS PLL and timing registers pro vided in the NAND controller.Arm Trace Timing Requirements for Cyclone V Devices Most debugging tools have a mechanism to adjust the capture point of trace data.HPS JTAG Timing Specifications Table 54.Fast and Standard POR Delay Specification for Cyclone V Devices POR Delay Minimum Maximum Unit F ast 4 12 (74) ms Standard 100 300 ms Related Information MSEL Pin Settings Provides more information about POR delay based on MSEL pin settings for each configur ation scheme. FPGA JTAG Configuration Timing Table 56. Cyclone V devices use additional clock cycles to decrypt and decompress the configur ation data. If nSTATUS is not monitored, follow the t CF2CK specification. CLKUSR period) — — T init Number of clock cycles required for device initialization 8,576 — Cycles Related Information FPP Configuration Timing Provides the FPP configuration timing w aveforms. (82) This value can be obtained if y ou do not delay configuration b y externally holding nSTATUS low. (83) If nSTATUS is monitored, follow the t ST2CK specification.AS Timing Parameters for AS ?1 and ?4 Configurations in Cyclone V Devices The minimum and maximum numbers apply to both the internal oscillator and CLKUSR when either one is used as the clock source for device configuration. The t CF2CD, t CF2ST0, t CFG, t ST ATUS, and t CF2ST1 timing par ameters are identical to the timing parameters for passive serial (PS) mode listed in PS Timing Parameters for Cyclone V Devices table. Y ou can obtain the t CF2ST1 value if you do not delay configur ation by externally holding nSTATUS low. DCLK Frequency Specification in the AS Configuration Scheme This table lists the internal clock frequency specification for the AS configuration scheme. The DCLK frequency specification applies when y ou use the internal oscillator as the configuration clock source. The AS multi-device configur ation scheme does not support DCLK frequency of 100 MHz. Parameter Minimum Typical Maximum Unit DCLK frequency in AS configuration scheme 5.3 7.9 12.5 MHz 10.6 15.7 25.0 MHz 21.3 31.4 50.0 MHz 42.6 62.9 100.0 MHz Passive Serial (PS) Configuration Timing Table 62. CLKUSR period) — — T init Number of clock cycles required for device initialization 8,576 — Cycles Related Information PS Configuration Timing Provides the PS configuration timing w aveform. (92) If nSTATUS is monitored, follow the t ST2CK specification. If nSTATUS is not monitored, follow the t CF2CK specification. (93) The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.Initialization Clock Source Option and the Maximum Frequency for Cyclone V Devices Initialization Clock Source Configuration Scheme Maximum Frequency (MHz) Minimum Number of Clock Cycles Internal Oscillator AS, PS, and FPP 12.5 T init CLKUSR (94) PS and FPP 125 AS 100 DCLK PS and FPP 125 Configuration Files Table 64. Uncompressed.rbf Sizes for Cyclone V Devices Use this table to estimate the file size before design compilation. Different configuration file formats, such as a hexadecimal file (.hex ) or tabular text file (.ttf ) format, have different file sizes. For the different types of configur ation file and file sizes, refer to the Intel Quartus Prime software. However, for a specific version of the Intel Quartus Prime software, any design targeted for the same device has the same uncompressed configur ation file size. The IOCSR raw binary file (.rbf ) size is specifically for the Configur ation via Protocol (CvP) feature.Minimum Configuration Time Estimation for Cyclone V Devices The estimated values are based on the configur ation.rbf sizes in Uncompressed.rbf Sizes for Cyclone V Devices table. Variant Member Code Active Serial (97) Fast Passive Parallel (98) Width DCLK (MHz) Minimum Configuration Time (ms) Width DCLK (MHz) Minimum Configuration Time (ms) Cyclone V E A2 4 100 53 16 125 11 A4 4 100 53 16 125 11 A5 4 100 85 16 125 17 A7 4 100 140 16 125 28 A9 4 100 257 16 125 51 Cyclone V GX C3 4 100 36 16 125 7 C4 4 100 85 16 125 17 C5 4 100 85 16 125 17 C7 4 100 140 16 125 28 C9 4 100 257 16 125 51 Cyclone V GT D5 4 100 85 16 125 17 D7 4 100 140 16 125 28 D9 4 100 257 16 125 51 Cyclone V SE A2 4 100 85 16 125 17 A4 4 100 85 16 125 17 A5 4 100 140 16 125 28 A6 4 100 140 16 125 28 continued. (97) DCLK frequency of 100 MHz using external CLKUSR. (98) Maximum FPGA FPP bandwidth may exceed bandwidth av ailable from some external storage or control logic.User Watchdog Internal Oscillator Frequency Specifications Table 67. The data is typically used prior to designing the FPGA to get an estimate of the timing budget as part of the link timing analysis.Programmable Output Buffer Delay for Cyclone V Devices This table lists the delay chain settings that control the rising and falling edge delays of the output buffer. Y ou can set the programmable output buffer delay in the Intel Quartus Prime softw are by setting the Output Buffer Delay Control assignment to either positive, negative, or both edges, with the specific v alues stated here (in ps) for the Output Buffer Delay assignment. JT AG timing specifications JT AG Timing Specifications continued.Sampling window (SW) Timing diagram— The period of time during which the data must be valid in order to capture it correctly. The AC v alues indicate the voltage levels at which the receiver must meet its timing specifications. The DC v alues indicate the voltage levels at which the final logic state of the receiver is unambiguously defined. After the receiver input has crossed the AC v alue, the receiver changes to the new logic state. The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide predictable receiver timing in the presence of input waveform ringing. TCCS (channel-to-channel-skew) The timing difference between the fastest and slowest output edges, including the t CO v ariation and clock skew, across channels driven by the same PLL. The clock is included in the TCCS measurement (refer to the Timing Diagr am figure under SW in this table). V ICM Input common mode voltage— The common mode of the differential signal at the receiver. V ID Input differential voltage swing— The difference in voltage between the positive and complementary conductors of a differential transmission at the receiver. V DIF(AC) AC differential input voltage—Minimum AC input differential voltage required for switching. V DIF(DC) DC differential input voltage— Minimum DC input differential voltage required for switching. V IH V oltage input high— The minimum positive voltage applied to the input which is accepted by the device as a logic high. V IH(AC) High-level AC input voltage V IH(DC) High-level DC input voltage V IL V oltage input low— The maximum positive voltage applied to the input which is accepted by the device as a logic low. V IL(AC) Low-level AC input voltage V IL(DC) Low-level DC input voltage V OCM Output common mode voltage— The common mode of the differential signal at the transmitter. V OD Output differential voltage swing— The difference in voltage between the positive and complementary conductors of a differential transmission line at the transmitter. DCLK is ignored after configuration is complete. November 2013 3.6 Updated T able 23, T able 30, and T able 31. January 2013 3.1 Updated T able 4, T able 20, and T able 56. Compile using Qsys and Quartus to obtain binaries that can be uploaded to thePress “Generate” button This file can be loadedTo do this: After the first load from SD card the FPGA can still be reprogrammed using the Programmer. Then, the following instruction can be run from the project root directory, and it will generate a header file describing the HPS address map.Reload to refresh your session. Reload to refresh your session. Figure 7-8 shows the HPS’ available boot flows. The Reset and Boot ROM stages are the only fixed parts of theAlthough the DE0-Nano-SoC has a DUAL-processor HPS (CPU0 and CPU1), the boot flow only executes on CPU0If you want to use both processors of the DE0-Nano-SoC, then USER SOFTWAREThe preloader is one of the most important boot stages. It is actually what one would call the boot “source”, asThe preloader can be stored on external flash-based memory, or in the. FPGA fabric. The preloader typically performs the following actions:Configure pin multiplexing through the system manager. Configure HPS clocks through the clock manager. Load the next boot software into the SDRAM and pass control to it. The preloader does NOT release CPU1 from reset. The subsequent stages of the boot process are responsibleThe reason it is considered a softcore component originates fromAs such, the HPSTherefore, it is possible to use the Cyclone V SoC in 3 different configurations:HPS-only. We will not cover the HPS-onlyIf you instantiated a Nios II processor in Qsys, you can useThe DE0-Nano-SoC has a lot of pins, which makes it tedious to start an FPGA design. It is recommended to use. After having defined a top-level module, it is necessary to map your design’s pins to the ones available on theOn one hand, bare-metal software enjoys the advantage of having no OS overhead. This has manyThis is very useful when trying to use the HPSSuch a programming environment is very similar to the one used by otherOn the other hand, bare-metal code has one great disadvantage, as the programmer must continue toFor example, we saw in 7.6.2.1 that the preloader does notFurthermore, supposing CPU1 is available for use, it is still difficult to run multithreaded code, as an OS generally handles program scheduling and CPU affinity for the programmer. TheRunning code over a linux operating system has several advantages.